采用延迟使用密封,在相同工艺中涂覆压敏热熔胶水和硅离型纸后,无需双面压敏胶带。作为无基材胶带的替代品、采用受专利保护的阀科SealTak®系统,价格便宜。通过在彩带、单珠、多珠或喷雾上进行压敏热熔,表层可贴上硅纸,以覆盖整个胶粘剂。因为购买散装胶粘剂和散装硅纸比无基材胶带便宜得多,所有这种方案可大大地降低了生产成本。不管速度、纸箱材料或幅宽如何,阀科胶粘剂和纸张涂覆设备结合多种质量保证产品,将这种制造工艺转换成盈利颇丰的商机。如欲了解更多内容,请马上与我们联系。
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